Supermicro SuperServer F619P3-FT

Product Overview

£8,022.53 (ex VAT) | £9,627.04 (inc VAT)

The new generation X11 Supermicro FatTwin™ is a high-density 8/4 hot-plug node SuperServer® system available with a variety of memory capacities, HDD technologies, M.2 SSD NVMe, PCIe alternatives, and networking capabilities.

SYS-F619P3-FT


Supermicro SuperServer F619P3-FT

The new generation X11 Supermicro FatTwin™ is a high-density 8/4 hot-plug node SuperServer® system available with a variety of memory capacities, HDD technologies, M.2 SSD NVMe, PCIe alternatives, and networking capabilities.

The FatTwin™ supports up to: 1.5TB ECC RDIMM DDR4-2666MHz memory in 12 DIMM slots, 1 PCI-E 3.0 x16 and 1 SIOM flexible nework card 8 ports of Broadcom SAS 3.0 (12Gbps) HBA or HW RAID, 10 ports of SATA 3.0 (6Gbps) with Intel® C621 controller, redundant Titanium Level (96%) Digital power supplies, integrated IPMI 2.0 with KVM over dedicated LAN, and dual Intel® Xeon® Scalable processor families up to 26 cores and 165W TDP.

The Supermicro FatTwin represents a revolution in Green Computing and is highly efficient by design; this system supports customers' critical applications while reducing Data Center TCO in order to help preserve the environment, and extends the compute and storage capabilities of Supermicro's existing Twin SuperServer systems to achieve increased performance and power efficiency. Due to its shared components, the FatTwin improves cost-effectiveness and reliability, while its modular architecture makes it flexible to configure and easy to maintain.

Versatile configurations allow the FatTwin to be optimized for many different environments including Enterprise, Data Center, Cloud Computing, HPC, Financial, Science and Engineering, File and Storage Servers.

 

Key Features

Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 x DIMM slots 1 x PCI-E 3.0 x16, 1 x PCI-E 3.0 x8 (LP), 1 x PCI-E 3.0 x16 (for SIOM ) 2 x Fixed 3.5" SATA3 drive bays. M.2 Interface: PCI-E 3.0 x4, M.2 Form Factor: 2260, 2280, 22110, M.2 Key: M-Key Dual GbE ports via SIOM Network card, 1 x dedicated IPMI LAN port (front) 1 x VGA, 2 x USB 3.0 ports (front) 8 x 8cm 13.5k RPM rear fans per enclosure 2200W Redundant Power Supplies Titanium Level (96% Efficiency)

 

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Product SKUs
SYS-F619P3-FT
  • SuperServer F619P3-FT (Black)
 
Motherboard


Super X11DPFF-SN
 
Processor/Cache (per Node)
CPU
  • Dual Socket P (LGA 3647)
  • 2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake),

    Dual UPI up to 10.4GT/s
  • Support CPU TDP 70-165W with IVR
Cores
  • Up to 28 Cores
Note BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors
 
System Memory (per Node)
Memory Capacity
  • 12 DIMM slots
  • Up to 3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM††
Memory Type
  • 2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro

†† Cascade Lake only. Contact your Supermicro sales rep for more info.
 
On-Board Devices
Chipset
  • Intel® C621 chipset
SATA
  • SATA3 (6Gbps); RAID 0, 1, 5, 10
Network Controllers
  • Flexible networking via SIOM
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
  • ASPEED AST2500 BMC
 
Input / Output (per node)
SATA
  • 14 SATA3 (6Gbps) ports
LAN
  • SIOM flexible Network card
  • 1 RJ45 Dedicated IPMI LAN port (front)
USB
  • 2 USB 3.0 ports (front)
VGA
  • 1 VGA port (front)
 
System BIOS
BIOS Type
  • 128Mb SPI Flash EEPROM with AMI BIOS
 
Management
Software
Power Configurations
  • ACPI Power Management
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 4U Rackmount
Model
  • CSE-F418IF3-R2K20BP
 
Dimensions and Weight
Width
  • 17.63" (448mm)
Height
  • 6.96" (177mm)
Depth
  • 29" (737mm)
Package
  • 28.3" (W) x 15.0" (H) x 42.4" (D)
Weight
  • Net Weight: 150 lbs (68.04 kg)
  • Gross Weight: 200 lbs (90.71 kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • Network activity LEDs
  • Information LED (Fan failure, Overheat)
 
Expansion Slots (per node)
PCI-Express
  • 1 PCI-E 3.0 x16 (Low-profile)
  • 1 PCI-E 3.0 x8 (Low-profile)
  • 1 PCI-E 3.0 x16 (SIOM)
 
Drive Bays (per node)
Fixed
  • 2 Fixed 3.5" SATA3 drive bays
M.2
  • M.2 Interface: 2 SATA/PCI-E 3.0 x4, RAID 0 & 1
  • M.2 Form Factor: 2260, 2280, 22110
  • M.2 Key: M-Key
 
System Cooling
Fans
  • 8x 8cm 13.5k RPM rear fans per enclosure
 
Power Supply
2200W Redundant Power Supplies with PMBus
Total Output Power and Input
  • 1200W with Input 100-127Vac
  • 1800W with Input 200-220Vac
  • 1980W with Input 220-230Vac
  • 2090W with Input 230-240Vac
  • 2200W with Input 220-240Vac (for UL/cUL use only)
  • 2090W with Input 230-240Vdc (for CCC only)
AC Input Frequency
  • 50-60Hz
Dimension

(W x H x L)
  • 76 x 40 x 336 mm
+12V
  • Max: 100A / Min: 0A (100-127Vac)
  • Max: 150A / Min: 0A (200-220Vac)
  • Max: 165A / Min: 0A (220-230Vac)
  • Max: 174.17A / Min: 0A (230-240Vac)
  • Max: 183.3A / Min: 0A (220-240Vac)
5VSB
  • Max: 1A / Min: 0A
Output Type
  • Backplanes (gold finger)
Certification Titanium Level96%  Titanium Level

  [ Test Report ]
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:

       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:

       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:

       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:

       5% to 95% (non-condensing)


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