Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device.
Key Features
Suitable for CPU, chipsets on Mainboard, VGA card, etc. Easy to use Zif Socket Templates ensure correct applying area with various CPU socket types Produces an even layer when using applicator Dielectric Wide range of application temperatures
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Colour
White
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Manufacturer
Cooler Master
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Other Features
Dielectric Constant - 4.4 at 100k Hz
Dielectric Strength - 550 volts/mil; 21.7 kV/mm
Dissipation Factor - 0.02 at 100k Hz
Shelf Life - 24 months from DOM
Specific Gravity - 2.37
Thermal Conductivity - 0.8 watts/meter- °C
Volume Resistivity - 5.0 x 1015
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Dimensions
Weight: 10g