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Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device.
Dielectric Constant - 4.4 at 100k Hz
Dielectric Strength - 550 volts/mil; 21.7 kV/mm
Dissipation Factor - 0.02 at 100k Hz
Shelf Life - 24 months from DOM
Specific Gravity - 2.37
Thermal Conductivity - 0.8 watts/meter- °C
Volume Resistivity - 5.0 x 1015
To help our clients make informed decisions about new technologies, we have opened up our research & development facilities and actively encourage customers to try the latest platforms using their own tools and if necessary together with their existing hardware. Remote access is also available
This webinar will explore the various market trends in the NVMe SSD space, such as new form factors, all whilst providing a deeper understanding of performance specifications and NVMe attributes such as Namespaces.