Supermicro Debuts New X10 3U MicroCloud Supporting Intel Xeon E5-2600 v3 Processor Family

Compact Architecture Extends MicroCloud X10 Family Delivering Performance, Energy Efficiency and Ease of Maintenance for a Wide Range of Applications in Data Center, Cloud and HPC Environments
Monday, 11 May 2015    Source:

San Jose, CA, May 7, 2015 - Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in high-performance, high-efficiency server, storage technology and green computing debuts a new 3U 8-node MicroCloud solution (SYS-5038MR-H8TRF) supporting Intel® Xeon® E5-2600 v3 (up to 145W TDP) optimized for data intensive analytics applications in Oil and Gas exploration and HPC environments. Each node of this new solution features 2x 3.5" hot-swap SATA3/SAS drive bays, 1x PCI-E 3.0 (x8) low-profile (LP) slot, up to 256GB LRDIMM, 128GB RDIMM, up to 2133MHz DDR4 ECC; 4x DIMMs, 2x GbE LAN ports, 1x dedicated LAN for IPMI Remote Management. It also incorporates Supermicro's Green Computing architecture advantages with 4x 8cm heavy duty hot-swap fans featuring optimal cooling zone and 1620W Redundant Platinum Level high-efficiency (95%) digital power supplies. The complete solution maximizes compute performance, density, and energy efficiency within a highly compact, modular easily serviceable form factor. The new performance based SYS-5038MR-H8TRF joins its latest Intel® Xeon® E3-1200 v3 and Intel® Atom™ C2750 based 24/12/8-node systems targeting web host, collocation services, cache server, CDN, video streaming, social networking and mobile applications, extending the 3U MicroCloud family to cover the widest range of applications across Enterprise, Data Center, Cloud and HPC environments.

"Supermicro's new X10 8-node MicroCloud supporting the Intel Xeon E5-2600 v3 processor family extends our solution coverage to the performance end of the spectrum, particularly for VDI, mobile applications, HPC and data analytics environments," said Charles Liang, President and CEO of Supermicro. "Our MicroCloud product family now covers the widest range of applications from top end of performance to mid-range enterprise applications, and extreme low-power energy-efficient appliances in a compact, modular 3U foot print."

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